Applications

1. OCP servers/Storage Devices

2. High Performance Computing (HPC)

3. Data center & Networking Equipment

4. OCP NIC 3.0 card

Features and Benefits

1.Support cable to board application

2.Multiple channels are optional: 1C(56pos.), 2C(84pos.), 4C (140pos.) and 4C+(168pos.)

3.Small size design: pitch 0.6mm connector,

4.Straight cable plug is available

5.Excellent SI performance: signal rates up to 56 GT/s PAM4 and 112 GT/s PAM4

6.Support power and high speed signal transmission together

7.Supports 85 ohm impedance applications

8.30-34AWG are available for both discrete and ribbon cable

9.RoHS compliant. Halogen free is available on request

Mechanical Performance

1. Mating Force: 31N maximum

2. Un-mating Force: 6N minimum

3. Rated durability cycles: 25 cycles minimum

Electrical Performance 

1. Voltage: 30VAC per contact

2. Current: 0.5A per signal contact, 1.1A per power contact

3. Contact resistance: 30mohm max. initial, 15mohm maximum change after stress test

4. Dielectric Withstanding Voltage: 300 VDC minimum for 100 ms

5. Insulation Resistance: 10 MΩ minimum between adjacent pins

Signal Integrity

1. Mated Connector Impedance: 85 ohm @23ps RT

2. Return loss: meet 56G PAM4

3. FEXT: meet 56G PAM4

4. NEXT: meet 56G PAM4

5. Insertion loss: meet 56G PAM4

Product Environmental Compliance

RoHS2.0: Compliant

China RoHS: Yes

REACH SVHC: Yes

Low-Halogen Status: Not Reviewed

Packing

        Per Amphenol‘s Site Operating Procedure #SOP-708 REV 2