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Z-Link 4C STR Plug

Product Description: Z-Link 4C 140Pin STR Plug Cable Assembly with Pull Tab
Series: Gen-Z
Signal Wire Size: 34-30AWG
Lock to mating part: With latch
Plating: connector Au 30u" or others
Color: black connector
Environmental Compliance: RoHS
Flammability: PCB UL94V-0, thermoplastic resin UL94V-0

Z-Link 4C STR Plug

Product Description: Z-Link 4C 140Pin STR Plug Cable Assembly with Pull Tab
Series: Gen-Z
Signal Wire Size: 34-30AWG
Lock to mating part: With latch
Plating: connector Au 30u" or others
Color: black connector
Environmental Compliance: RoHS
Flammability: PCB UL94V-0, thermoplastic resin UL94V-0

Applications

1. IT Datacom Servers

2. Storage Devices

3. High Performance Computing (HPC)

4. Base station(AAU)

5. OCP

 
Features and Benefits
1. Support cable to board and board to board application: 1.57mm PCB card thickness compatible with PCIe riser card
2. Multiple channels are optional: 1C(56pos.), 2C(84pos.), 4C (140pos.) and 4C+
3. Small size design: pitch 0.6mm connector
4. Straight cable plug is available, right angle, side exit and 
5. Support power and high speed signal transmission together
6. Supports 85 ohm impedance applications
7. 30-34AWG are available for both discrete and ribbon cable
8. Combined Power solution, high speed and sideband
 
Mechanical Performance
1. Mating force: 31N maximum
2. Unmating force: 6N minimum

3. Rated durability cycles: 25 cycles minimum  


Electrical Performance

1. Voltage: 30VAC per contact
2. Current: 0.5A per signal contact, 1.1A per power contact
3. Contact resistance: 30mohm max. initial, 15mohm maximum change after stress test
4. Dielectric Withstanding Voltage: 300 VDC minimum for 100 ms

5. Insulation Resistance: 10 MΩ minimum between adjacent pins 


Signal Integrity

1. PCIe Gen5
2. PCIe Gen6(can be upgrade to PCIe Gen6)
3. 56G PAM4
4. 112G PAM4(can be upgrade to 112G PAM4)
 
Product Environmental Compliance
RoHS2.0: Compliant
China RoHS: Yes
REACH SVHC: Yes

Low-Halogen Status: Not Reviewed  


Packing
Per Amphenol‘s Site Operating Procedure #SOP-708 REV 2




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